Arctic APT2012 100x100x1.5mm Thermal Pad (Pack of 4) :
The Arctic APT2012 Thermal Pad provides an efficient thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. The silicon based material outperforms generic pads by far, is flexible and adaptive and thus works also at low pressure.
• Very simple application
• Protection for sensitive processor chips
GREAT PRICE/PERFORMANCE RATIO
The Arctic APT2012 100x100x1.5mm is the ideal, budget-friendly choice for situations that require thermal transmission without needing particularly high performance.
USING THERMAL PADS
Thermal pads can be easily cut to the desired shape and size and can be used to ensure adequate temperature transfer on, among other things, RAM heat sinks and single-board computers.
With its low rigidity and good compression properties, the thermal pad serves as a perfect gap filler and easily bridges uneven surfaces and air gaps.
EASY INSTALLATION AND SAFE HANDLING
Arctic APT2012 100x100x1.5mm thermal pads are non-adhesive and can be precisely positioned.
The pad contains no metal particles, is electrically insulating and not capacitive. This makes handling them safe, since no damage can occur, even in contact with electrical components.
AVAILABLE IN DIFFERENT STRENGTHS AND PACKAGES
Each package contains 4 pads.
|Hardness: 0.5/1 mm||Thickness 35 Shore OO|
|Hardness: 1 mm||Thickness 20 Shore OO|
|Continuous Use Temperature||-40~150 °C|
|Specific Gravity||2.3 g/cc|
|Thermal conductivity||1.2 W/(m K)|
|Dielectric Constant @1MHz||3.9|
|Volume Resistance||1 X 10^12 Ω-cm|
|Flammability Rating||UL 94 V-0|