Arctic APT2560 145x145mm t:0.5mm Thermal Pad:
The ARCTIC Thermal Pad provides an efficient thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. The silicon based material outperforms generic pads by far, is flexible and adaptive and thus works also at low pressure.
• Perfect gap filler
• Particularly suitable to cool several modules
• Protection for sensitive processor chips
• Very simple application
EFFICIENT THERMAL CONDUCTIVITY
The thermal pad, which is based on silicone and a special filler, far outperforms generic and performance-oriented pads.
EXCELLENT PRICE/PERFORMANCE RATIO
In a test conducted by PC Games Hardware (11/2018), the pads‘ “excellent processability and reusability in every respect” were praised. Because of its fair pricing and good performance, our thermal pad was recommended as a “price-performance recommendation”.
BRIDGING THE GAP
Thanks to its low rigidity and good compression properties, the thermal pad acts as a perfect gap filler and easily bridges uneven surfaces and air gaps.
EASY INSTALLATION AND SAFE HANDLING
The ARCTIC Thermal Pads are non-adhesive and can therefore be placed precisely.
The pad contains no metal particles, is electrically insulating and not capacitive. This makes handling them safe, since contact with electrical parts does not lead to damage.
|Dimensions||50 x 50 mm, 120 x 20 mm,145 x 145 mm, 290 x 290 mm|
|Thermal Conductivity||6.0 W/mK|
|Hardness||50 Shore 00|
|Specific Gravity 3||3.2 g/cm|
|Continuous Use Temperature||-40~200|
|Volume resistance||1 X 10 Ω-cm|
|Breakdown Voltage||12 KV/mm|
|Tensile strength||2.5 Kgf/cm²|
|Dielectric constant||14.1816 at 60 Hz,13.0264 at 1K Hz, 13.0264 at 1M Hz|
|Thickness||0.5 mm or 1.0 mm or 1.5 mm, 12 1 X 10 Ω-cm|